MEYER participated in the Packaging & Recycling Congress held on June 4-5, 2025, in Warsaw. The event brought together key players from the packaging and recycling industries — manufacturers, recyclers, retailers, ESG experts, and government representatives.
Our team had the opportunity to attend a variety of engaging panels and presentations that offered fresh perspectives on the Polish recycling market, as well as on packaging and processing sectors. The congress provided valuable insights into upcoming legal changes, the deposit return system, and extended producer responsibility.
Organized by BMP, the congress focused on preparing the industry for the challenges of 2025, discussing practical aspects of the deposit system, shared responsibility for the future of packaging, and innovations involving automation and artificial intelligence.
We are glad to have been part of this event and to exchange knowledge that will help build a more sustainable future for the packaging sector.
